Yixing Dingfan New Energy Technology Co., Ltd
| Place of Origin: | China |
|---|---|
| Brand Name: | Dingfan |
| Certification: | ISO9001 |
| Minimum Order Quantity: | 300 kg |
| Price: | Negotiate |
| Packaging Details: | Standard Export Package |
| Delivery Time: | 5-8 workdays |
| Payment Terms: | T/T, L/C |
| Supply Ability: | 100 tons per year |
| Characteristic: | Good Creep Resistance | Specification: | Various Shapes Of Welding Strips And Lugs |
|---|---|---|---|
| Nickname: | Gold-tin Alloy | Tensile Strength: | 276MPa |
| Recommended Soldering Temperature: | ＞310℃ | Densityg/cm³: | 14.51 |
Gold Tin Alloy Solder Preforms High Melting Point Solder
Product Description
Gold-tin alloy is a kind of electronic welding, which has a very good market and prospects. Gold-tin alloy using gold-tin alloy solder in electronic applications Gold-tin alloy is produced by brazing technology and is an important technology for assembling electronic products. In order to obtain an ideal brazed connection, the choice of brazing material is crucial. The solderability, melting point, strength and Young's modulus, thermal expansion coefficient, thermal fatigue, creep and creep resistance of the brazing material can all affect the quality of the brazed connection.
Eutectic gold 80% tin 20% brazing alloys (melting point 280°C) have been used for many years in the semiconductor and other industries. Due to its excellent physical properties, gold-tin alloy has gradually become the best brazing material for optoelectronic device packaging
| Material name | solidus℃ | liquidus℃ | Recommended Soldering Temperature℃ | densityg/cm³ | Thermal conductivityW/m.℃ | Tensile Strength(MPa) |
| Au80Sn20 | 280 | 280 | ＞310 | 14.51 | 57 | 276 |
Gold-tin alloy is a binary alloy of gold and tin, with a eutectic temperature of 278°C and a concentration of 30% Sn. Alloys such as AuSn20, AuSn27 and AuSn90 have high thermal conductivity, low vapor pressure, excellent corrosion resistance, good wettability and fluidity. It is manufactured by the "hot composite-cold rolling" process, which can roll foils of 0.05 to 0.1 mm. Gold-tin alloys are used for brazing of gold-plated or gold-plated alloy lead frames and leads. Adding (50-300) × 10-6 platinum and/or palladium new brazing filler metal to AuSn20 alloy has the effect of inhibiting the excessive diffusion and random flow of the brazing filler metal and improving the brazing effect.
Product display
Advantages of Au-Sn Solder
1. Moderate brazing temperature
The brazing temperature is only 20-30°C higher than its melting point (ie, about 300-310°C). During the brazing process, based on the eutectic composition of the alloy, a small degree of superheat can melt and infiltrate the alloy; the solidification process of the alloy is very fast. Therefore, the use of gold-tin alloys can greatly shorten the entire brazing process. The brazing temperature range of gold-tin alloys is suitable for component assembly that requires high stability. At the same time, these components can also withstand subsequent assembly using lead-free solder at relatively lower temperatures. The assembly temperature of these solders is around 260°C. Eutectic gold-tin solder (Au80Sn20) offers a temperature operating range up to 200°C.
2. High strength
The yield strength of gold-tin alloy is very high, and its strength can meet the requirements of air tightness even at a temperature of 250-260 °C.
3. No flux required
Gold accounts for a large proportion (80%) in the alloy composition, and the degree of oxidation on the surface of the material is low. The use of chemical fluxes is not necessary if a vacuum or a reducing gas such as a mixture of nitrogen and hydrogen is used in the brazing process. This is one of the most striking features and is most important for electronics, especially optoelectronic device packaging.
4. Infiltration
Has good wettability and corrosion of lead-free tin solder on the gold-plated layer. The composition of the gold-tin alloy is close to that of the gold-plated layer, so the degree of infiltration of very thin layers by diffusion is very low, and there is no migration phenomenon like silver.
5. Low viscosity
Liquid gold-tin alloys have very low viscosity, which allows them to fill some large voids. No liquidity in most cases.
6. Au80%Sn20% solder has high corrosion resistance, high creep resistance and good thermal and electrical conductivity, and the thermal conductivity reaches 57 W/m·K.
7. Lead-free.
8. Form temperature steps with low melting solder.
AuSn alloys have important applications in laser encapsulation in optoelectronics. Gold-tin alloy will be an important packaging material for the promotion of optical communication and photonic computers in the next five years.
Packaging and Shipping
Product packaging usually depends on the size and shape of the product selected by the customer. We currently have several main packaging methods:
1. VR box; 2. Bottled; 3. Reel; 4. Blue film; 5. Tape etc.
FAQ
1.Are you trading or manufacturer ?
We are company,and we have our own factory
2.How long is your delivery time?
| Quantity(kilograms) | 1 - 500 | >500 |
| Est. Time(days) | 10 | To be negotiated |
3.Do you provide samples ? is it free or extra ?
Yes, we could offer the sample for free charge but do not pay the cost of freight.
If you have another question, pls feel free to contact us