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Place of Origin: | China |
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Brand Name: | Dingfan |
Minimum Order Quantity: | 300 kg |
Price: | Negotiate |
Packaging Details: | Standard Export Package |
Delivery Time: | 5-8 workdays |
Payment Terms: | T/T, L/C |
Supply Ability: | 100 tons per year |
Features: | Strong Antioxidant Capacity | Name: | Preformed Solder Bumps |
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Advantage: | Good Solderability | Shape: | Strip |
Custom Processing: | Yes | Melting Point: | Low |
Highlight: | Preformed Bar Solder Lead Free,Bar Solder Lead Free Good Solderability |
Preformed Solder Bumps Strip Lead-Free Solder Bars
Product Description
Lead-free solder
Sn-0.7Cu alloy
The Sn-0.7Cu alloy is a eutectic alloy of Sn and Cu, and the eutectic temperature is 227°C. Generally speaking, the working temperature of Sn-0.7Cu alloy for wave soldering is about 245-260℃, and users can also make appropriate adjustments according to the equipment and process conditions used.
Sn-0.7Cu solder advantages:
●High strength and anti-drop performance, with good mechanical properties and solder joint reliability
●Low sensitivity to impurity elements, stable performance and easy recovery, more in line with environmental protection requirements
●Suitable for various welding processes: wave soldering, tin furnace tin plating process, etc.
●Pb-free alloy without silver, with lower cost.
SAC305 Solder Advantages
The yield is better than SAC0307, and the bridging resistance is better than Sn/Cu0.7 alloy; very good fluidity reduces the bridging level;
●The typical wetting speed is 0.65sec, which is equivalent to 0.75sec of SAC0307, far better than Sn/Cu0.7 alloy;
●High purity, low oxide, low tin dross generation;
●Good solderability; fast wetting speed; higher yield,
●Compatible with various fluxes.
●Thermal cycle performance
Lead-free alloy type
alloy composition | melting point(℃) | proportion | use | ||
solidus | liquidus | (g/cm3) | |||
1 | Sn-Cu0.7 | 227 | 227 | 7.32 |
Dip Soldering, Wave Soldering |
2 | Sn-Ag0.3-Cu0.7 | 217 | 228 | 7.33 | |
3 | Sn-Ag3.0-Cu0.5 | 217 | 218 | 7.40 | |
4 | Sn99.95 | 232 | 232 | 7.28 | Wave Soldering Addition to Reduce Copper Content |
5 | Sn-Ag3.5 | 221 | 221 | 7.37 | |
6 | Sn-Sb5 | 240 | 245 | 7.25 | |
7 | Sn-Bi58 | 138 | 138 | 8.54 | low temperature welding |
8 | Sn-In52 | 118 | 118 | 7.3 | low temperature welding |
Other solder alloys are available upon request.
Advantage
Strong antioxidant capacity
Good liquidity and sufficient volume
Easy to use and no cleaning
High-purity metal raw materials
Be applicable
It is used for PCB circuit boards, metal shells, metal-glass packages, semiconductor integrated circuits, filter devices, microwave devices, high-power devices, connectors, sensors, and metal shells or ceramic shells for hermetically sealed packaging of optoelectronic devices.
Generally divided into:
Standard Type: 0.025mm, 0.05mm
Thinner: 0.1mm, 0.2mm, 0.3mm, 0.4mm, 0.5mm
Thicker type: 0.5mm-1.0mm
Thickened type: 1.0mm or more
Width: generally about 50mm
For example: 50*0.05mm, which means the width is 50mm and the thickness is 0.05mm.
Tip: Other thicknesses and widths can be customized according to customer requirements
Packaging and Shipping
Packing Details : Carton and wooden box packaging
Delivery Details : 5-10 days(Negotiated and decided on a case-by-case basis)
FAQ
1.Are you trading or manufacturer ?
We are company,and we have our own factory
2.How long is your delivery time?
Quantity(kilograms) | 1 - 500 | >500 |
Est. Time(days) | 10 | To be negotiated |
3.Do you provide samples ? is it free or extra ?
Yes, we could offer the sample for free charge but do not pay the cost of freight.
If you have another question, pls feel free to contact us