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Place of Origin: | China |
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Brand Name: | Dingfan |
Minimum Order Quantity: | 300 kg |
Price: | Negotiate |
Packaging Details: | Standard Export Package |
Delivery Time: | 5-8 workdays |
Payment Terms: | T/T, L/C |
Supply Ability: | 100 tons per year |
Name: | Tin Silver Copper SAC305 Solder Tab | Melting Point/℃ Solid/liquid Phase: | 217 / 218 |
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Density G/cm³: | 7.37 | Resistivity µΩ·m: | 0.132 |
Thermal Conductivity W/m·K: | 58 | Thermal Expansion Coefficient 10-6/℃: | 21 |
Highlight: | Tin Lead Free Solder,Silver Lead Free Solder,SAC305 Solder Tabs For Batteries |
Tin Silver Copper SAC305 Solder Tab Tin Silver Copper Preforme
Product Description
Features:
- Lead-free solder with a melting point of 217/218°C
- good wettability
- Excellent mechanical properties
- Good fatigue resistance and high reliability of welded joints
- Compatible with all types of flux
- Sn-Ag-Cu based solder alloy with better price and performance
Sn-Ag-Cu(SAC) is the most widely used lead-free solder alloy system for electronic brazing. Such as SAC105 (Sn98.5Ag1Cu0.5), SAC305 (Sn96.5Ag3Cu0.5), SAC387 (Sn95.5Ag3.8Cu0.7) and SAC405 (Sn95.5Ag4Cu0.5) are usually used for reflow soldering, wave soldering and manual Soldering, the melting point is around 217°C. Among these solders, SAC305 is widely used and supported by IPC. For SAC305 (Sn96.5Ag3Cu0.5) solder, its hardness, tensile strength, yield strength, shear strength, impact strength and creep strength are higher than those of eutectic Sn63Pb37. Wetting properties are also better than Sn-Cu and Sn-Ag solders.
Solder Composition
Element | Wt% |
银(Ag) | 3.0±0.2 |
铜(Cu) | 0.5±0.2 |
锡(Sn) | margin |
Physical Properties
product name | Melting point/℃ solid/liquid phase |
density g/cm³ |
Resistivity µΩ·m |
Thermal conductivity W/m·K |
Thermal expansion coefficient 10-6/℃ |
tensile strength Mpa |
SAC305 Sn96.5Ag3.0Cu0.5 |
217 / 218 | 7.37 | 0.132 | 58 | 21 | 50 |
Operation details:
- Solder pick up:
Use an anti-static jig to pick up the solder to prevent solder contamination and deformation.
- Flux Compatibility:
SAC305 solder is compatible with the major no-clean and water-soluble electronic grade fluxes currently on the market.
Processing size
thickness(t) | Typical tolerances for length, width or diameter (L/W/D) | |
t<0.40mm | ±0.02mm | |
0.40mm≤ t <1.00mm | ±0.03mm | |
t ≥1.00mm | ±0.05mm | |
thickness(t) | Thickness Typical Tolerance | |
conventional solder alloys | Indium alloy | |
t<0.05mm | ±0.005mm | ±0.01mm |
0.05mm≤ t <0.10mm | ±0.008mm | ±0.01mm |
0.10mm≤ t <0.20mm | ±0.01mm | |
0.20mm≤ t <0.40mm | ±0.02mm | |
0.40mm≤ t <1.00mm | ±0.03mm | |
t ≥1.00mm | ±5% |
Storage and Product Management
-store
The best storage temperature of this product is 25±5℃, and the relative humidity is less than or equal to 55%RH.
-Product management
Keep container tightly closed when product is not in use.
Safety
- Please use this product with adequate ventilation and certain personal protection conditions.
- Please do not mix with other toxic chemicals.
Packaging and Shipping
Packing Details : Carton and wooden box packaging
Delivery Details : 5-10 days(Negotiated and decided on a case-by-case basis)
FAQ
1.Are you trading or manufacturer ?
We are company,and we have our own factory
2.How long is your delivery time?
Quantity(kilograms) | 1 - 500 | >500 |
Est. Time(days) | 10 | To be negotiated |
3.Do you provide samples ? is it free or extra ?
Yes, we could offer the sample for free charge but do not pay the cost of freight.
If you have another question, pls feel free to contact us